Skip to content

Industry / Semiconductor

Semiconductors

From lead frame die manufacturing to final testing, Kataken Seiko supports the semiconductor back-end process through three businesses: dies, mass production and equipment.

[ SEC.01 ]

Requirements

Semiconductor Industry Requirements

Semiconductor packages continue to become smaller, with ever-higher pin counts. IC lead frames, which form the foundation of a package, require increasingly fine pitch between the tips of the inner leads.

Manufacturing dies for lead frames requires advanced technology. Kataken Seiko meets fine-pitch requirements by producing die components with micromachining technology.

Semiconductor-related die and mold components also require submicron-level precision. By handling die design and manufacturing as well as mass production of parts in-house, Kataken Seiko also takes responsibility for stable quality in mass production.

[ SEC.02 ]

Solutions

What We Cover

Kataken Seiko supports each stage of the semiconductor back-end process.

A-01

Lead Frame

Lead Frame Die Manufacturing and Mass Production

An IC lead frame is a thin metal sheet that forms the foundation of semiconductor packages for integrated circuits such as ICs and LSIs. It holds the semiconductor chip in place, serves as internal wiring, and provides the connection terminals when the package is mounted on a printed circuit board.

Kataken Seiko handles both the design and manufacturing of press dies for IC lead frames and the mass production of stamped parts using those dies. In addition to lead frames for ICs and LSIs, we also handle lead frames for discrete semiconductors, photocouplers, LEDs and more.

A-02

Test Components

Components for Final Testing

Final testing of semiconductors uses IC sockets that connect the device to the tester. IC sockets are classified into burn-in sockets, which test reliability such as durability, and test sockets, which measure electrical characteristics.

Kataken Seiko designs, manufactures and sells injection-molded IC sockets and metal contact pins.

[ SEC.03 ]

Products

Example Products

P-01

IC Lead Frames (for ICs and LSIs)

P-02

Lead Frames for Discrete Semiconductors, Photocouplers and LEDs

P-03

IC Sockets (Burn-In Sockets and Test Sockets)

P-04

Contact Pins

CONTACT

Consult Us About Dies and Molds

We welcome inquiries about die and mold manufacturing and quotations.
You can consult us even before your specifications are finalized.