Strength / Technology & Precision
Technology & Precision
From submicron-level precision machining to plates up to 3,000 mm long. Kataken Seiko's technology is backed by official awards and half a century of development history.
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Precision Range
Precision Machining from Micro Parts to Large Plates
Kataken Seiko's die and mold components require submicron-level precision. We meet the trend toward finer pitches in semiconductor packages with micromachining technology, and we have a track record of developing dies for micro deep drawing.
At the same time, we can also machine plates up to 3,000 mm long. Our technical range lies in machining everything from micro to large parts to the accuracy each application requires. We also work with 3D CAD data and design in 3D.
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Standardization
Standardization Underpins Precision
Our founder, Kazuo Hamada, studied die and mold making in the United States. Convinced that building high-precision dies and molds requires standardized die and mold structures, he made a major contribution to Japan's JIS standards for dies and molds.
This philosophy of standardization lives on in our technology today. Typical examples include the IQL (Incline Quick Loading) Transfer Die System, which achieves extremely high repeatability through incline-based positioning, and ADMS DIE MASTER, our in-house CAD/CAM system for die design and manufacturing.
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Awards & Development
External Recognition and Development Track Record
We have also developed and patented SILENT DIE, a low-noise die.
In addition, the dies and production systems we have built have been described as "the world's smallest" and "the world's fastest."
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STRENGTH
Our Strengths
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TECHNOLOGY & SERVICES
Technology & Services
CONTACT
Consult Us About Dies and Molds
We welcome inquiries about die and mold manufacturing and quotations.
You can consult us even before your specifications are finalized.