Press Dies / Semiconductor

Precision Press Dies: Semiconductors

We design and build press dies for semiconductor applications, including IC lead frames. Our micromachining technology meets the demand for ever-finer pitches in semiconductor packages.

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IC Lead Frame

What Is an IC Lead Frame?

An IC lead frame is a thin metal sheet that forms the base of semiconductor packages for integrated circuits such as ICs and LSIs. It supports and holds the semiconductor chip, serves as the internal wiring, and provides the connection terminals when the package is mounted on a printed circuit board or similar substrate.

An IC lead frame consists of three elements: the die pad, which supports and holds the semiconductor chip; the inner leads, which provide internal wiring to the chip; and the outer leads, which serve as terminals for external connections.

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Fine Pitch

Meeting Fine-Pitch Requirements

Building dies for IC lead frames requires advanced technology. As semiconductor packages become smaller and gain more pins, the pitch at the tips of the inner leads continues to get finer.

Kataken Seiko meets these fine-pitch requirements by producing die components with micromachining technology.

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Lead Frame Types

Supported Lead Frame Types

In addition to semiconductor packages for integrated circuits such as ICs and LSIs, Kataken Seiko builds dies and performs stamping for lead frames used in discrete semiconductors, photocouplers, LEDs and more.

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Back-End Role

Role in the Semiconductor Back-End Process

The lead frame is the starting point of the semiconductor back-end process. A semiconductor chip is mounted on a lead frame produced with a press die, and the package is completed after wiring and final testing.

Beyond lead frame dies and mass production, Kataken Seiko also produces IC sockets for final testing. We support the entire back-end process through our three businesses: dies, mass production and equipment.

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Specifications

Please contact us regarding product specifications and processing conditions.

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Order Options

How to Work with Us

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Dies Only

We design, build and sell dies as an independent business.

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Integrated Orders: Die Building to Mass Production

With integrated expertise from die building to stamping, we handle the production of IC lead frames.

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Combined Orders with Equipment

We also handle inquiries that include mass-production equipment, such as tie-bar cut and trim & form (T/C & T/F) systems.

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TECHNOLOGY & SERVICES

Technology & Services

CONTACT

Consult Us About Dies and Molds

We welcome inquiries about die and mold manufacturing and quotations.
You can consult us even before your specifications are finalized.