In the back-end processes of semiconductor manufacturing, a semiconductor chip is anchored in the die pad area of a lead frame manufactured using IC lead frame dies and discrete dies, and the chip and an inner lead is wire-bonded with an item such as a gold wire. Afterwards, the semiconductor chip is sealed with resin (sealer) to protect it from damage or impacts (molding).
A plastic-sealed lead frame is separated into each semiconductor with semiconductor manufacturing equipment including T/C & T/F systems, laser-stamped, and then arranged/packaged in trays and tubes.
Semiconductors are tested for abnormalities through humidity/voltage testing, electrical property testing, and appearance inspection, and then defective parts are removed.
We design, manufacture, and sell resin casting molds and T/C & T/F equipment and molds used in the back-end processes of semiconductor manufacturing, in addition to IC sockets for injection-molded products and contact pins for processed metal parts used in final inspections.
